IEEE FLEPS 2021 Organizers

Organizing Committee

General Chair

Ravinder Dahiya
University of Glasgow, Scotland, UK

Technical Program Co-Chair

Luigi Occhipinti
University of Cambridge, Cambridge, UK

Arokia Nathan
D touch Technologies, Cambridge, UK

Conference Treasure

Zeynep Celik-Butler
University of Texas at Arlington, Texas, USA

Local Organizing Chair

Alex Casson
University of Manchester, UK

Focused Session Co-chairs

Simon Johnson
Centre for Process Innovation, UK
Marrocco Gaetano
University of Rome, Italy

Tutorial Co-chairs

Vincenzo Pecunia
Soochow University, China

Vincenzo Vinciguerra
STMicroelectronics, Italy

Awards Co-chairs

Vassili Karanasios
University of Waterloo, Canada

Chen Jiang
University of Cambridge, UK

Publicity Co-chairs

P Susthitha Menon
Universiti Kebangsaan Malaysia

Joseph Andrews
University of Wisconsin - Madison, USA

PCO

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www.conferencecatalysts.com

 


Steering Committee

Ravinder Dahiya
University of Glasgow, UK

John A. Rogers
Northwestern University, USA

Zeynep Celik-Butler
University of Texas, Arlington, USA

Paolo Lugli
University of Bozen, Italy

Praveen Ramamoorthy
Indian Inst. of Science Bangalore, India

Arokia Nathan
3D touch Technologies, Cambridge, UK

Luigi Occhipinti
University of Cambridge, UK

Aaron Voon-Yew Thean
National University of Singapore

Vincenzo Vinciguerra
ST Microelectronics

Professor George Malliaras
University of Cambridge, UK

Joseph Wang
University of California, San Diego (UCSD), USA

Takao Someya
University of Tokyo, Japan

Kourosh Kalantar-Zadeh
University of New South Wales, Sydney, Australia

Joachim N. Burghartz
IMS CHIPS, Germany

Vassili Karanasios
University of Waterloo, Canada

Simon Johnson
Centre for Process Innovation, UK