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On behalf of the IEEE FLEPS Organizing Committee, we thank you for your participation in the IEEE FLEPS 2021 virtual conference. With your help, we were able to bring together a community of about 300 attendees from around the world.
It’s necessary to our technical community continues to grow and learn together to advance technology, even during these uncertain and challenging times. Whether you watched presentations on-demand or browsed the conference proceedings, we are grateful that you took the time to participate.
Additionally, we would like to extend a special thank you to our colleagues who helped make these events possible, to our Patrons who invested in the success of the events, and to the Authors and Presenters who contributed their research and quickly adapted to the virtual platform.
We hope to see you all at IEEE FLEPS 2022!
IEEE FLEPS 2021 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems
Presented papers will be included in the Proceedings of IEEE FLEPS 2021 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2021 papers to the Special Journal Issue in the IEEE Sensors Journal.
The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.
For further information, contact Coral Miller at Conference Catalysts, LLC.
