In this talk, inkjet-/3D-printed antennas, interconnects, “smart” encapsulation and packages, RF electronics, microfluidics and sensors fabricated on glass, PET, paper and other flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of Millimeter-Wave Modules for Smart Bimonitoring and Pathogen sensing. Prof. Tentzeris will touch up the state-of-the-art area of fully-integrated printable broadband wireless modules covering characterization of 3D printed materials up to E-band, novel printable “ramp” interconnects and cavities for IC embedding as well as printable structures for self-diagnostic and pathogen sensing. The presented approach could potentially set the foundation for the truly convergent wireless sensor ad-hoc networks of the future with enhanced cognitive intelligence and “rugged” encapsulations for wearable and implantable applications. Prof. Tentzeris will discuss issues concerning the power sources of “near-perpetual” RF modules, including flexible miniaturized batteries as well as power-scavenging approaches involving thermal, EM, vibration and solar energy forms. The final step of the presentation will involve examples from shape-changing 4D-printed (origami) packages, reflectarrays and mmW wearable (e.g. biomonitoring) antennas and RF modules. Special attention will be paid on the integration of ultrabroadband (Gb/sec) inkjet-printed nanotechnology-based backscattering communication modules as well as miniaturized printable wireless (e.g.CNT) sensors coupling Internet of Things (IoT) and 5G with smart biomonitoring applications. It has to be noted that the talk will review and present challenges for inkjet-printed organic active and nonlinear devices as well as future directions in the area of environmentally-friendly (“green”) RF electronics and “smart-skin’ conformal sensors.