Prof. Matti Mäntysalo received the D.Sc. (Tech.) degree in electrical engineering from the Tampere University of Technology, Tampere, Finland, in 2008. From 2011 to 2012, he was a Visiting Scientist with the iPack Vinn Excellence Center, School of Information and Communication Technology, KTH Royal Institute of Technology, Stockholm, Sweden. He is currently a Professor of Electronics with Tampere University. His current research interests include printed electronics materials, fabrication processes, stretchable electronics, sensors, and the integration of printed electronics with silicon-based technology (hybrid systems). He has published over 100 papers. He is active in IEEE, IEC, and Organic Electronic Association. He was a recipient of the Academy Research Fellow Grant (2015-2020) from the Academy of Finland. He has awarded by Nokia Research Center from the first inkjet printed GSM baseband integration.
Dr Abhishek S. Dahiya is a research associate at the BEST group in the School of Engineering at University of Glasgow. He has received his Ph.D. from the GREMAN laboratory, Université François Rabelais de Tours, France in 2016. He performed his postdoctoral work at the GREMAN laboratory (2016-2017), the University of Bordeaux (ICMCB/CNRS) (2018-2019), and at the IES CNRS/Université de Montpellier (2019-2020) in France. He has published 28 high-impact research articles in leading journals and 1 US patent. His research interest covers synthesis of nanomaterials, printed and flexible electronics, energy harvesting, and semiconductor device physics.
Printing technologies are aiding and revolutionizing the burgeoning field of flexible/bendable/stretchable sensors and electronics by providing cost-effective routes for processing diverse electronic materials at temperatures that are compatible with plastic and wood-based substrates. Simple patterning techniques and decreased amount of processing steps, reduced materials wastage, and low fabrication costs make printing technologies very attractive for the electronics manufacturing. These features of printed electronics have allowed researchers to explore new avenues for materials processing and to develop sensors and systems on even non-planar and deformable surfaces, which otherwise are difficult to realize with the conventional wafer-based fabrication techniques. In this tutorial, participants will gain an overview of various printed electronics manufacturing technologies (contact and non-contact) and potential applications developed so far. This tutorial will bring together various printing techniques and will provide a detailed discussion by also involving the key electronic and substrate materials, systems, and applications. Potential capabilities and critical limitations of each technology will be highlighted, and possible solutions or alternatives will be discussed. The tutorial will also present some recent examples of high performance printed and flexible devices including transistors, sensors etc.
© Copyright 2021 IEEE – All rights reserved. Use of this website signifies your agreement to the IEEE Terms and Conditions.
A not-for-profit organization, IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.
This site is created, maintained, and managed by Conference Catalysts, LLC. Please feel free to contact us for any assistance.
IEEE websites place cookies on your device to give you the best user experience. By using our websites, you agree to the placement of these cookies. To learn more, read our Privacy Policy.