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Robert Reuss

Presenter Bio

Dr. Robert Reuss has consulted for technical organizations since 2006. As a DARPA Program Manager in the Microsystems Technology Office from 2001 to 2006, he was responsible for several research thrusts into fabrication of flexible, large area electronics including high mobility TFTs for digital and RF applications and organic photovoltaics, as well as conventional microelectronics efforts that included exploiting mainstream semiconductor processes for high performance analog, mixed signal RF and MMW applications, reconfigurable, multi-core processor design, asynchronous logic design methodology, and sub-threshold, ultra-low power operation. Since September 2006, he has been an independent consultant. Prior to joining DARPA, Dr. Reuss spent twenty years in various technology and research management positions with Motorola. Earlier, he worked for the U.S. government as a research and development manager for seven years and was a Research Faculty member at the University of Colorado for three years. Dr. Reuss received a Ph.D. in Chemistry from Drexel University in 1971. He has published over 50 papers and has been awarded 13 U.S. patents. His technology interests lie in the area of application of materials and electrochemistry technologies for advanced microelectronic applications and microsystems integration as well as large area electronics.

Most recently he was the recipient of the 2018 FLEXI Awards Innovation and Leadership in Flexible Hybrid Electronics Technology Champion –for his extraordinary dedication to growing the flexible electronics industry, early recognition of the impact of large area electronics and strong contributions to helping build the FLEX Conference.

In this talk I will review the following topics to describe what, to me, are the key periods in the creation, development, current status, and possible future directions of flexible sensors and electronics.
  • Context for Flex Electronics & Sensors: The electronics industry in the 80s and 90s and organic electronics.
  • Early Motivations: What were some of the applications envisioned?
  • When/Where Does Printing Fit In: Could it provide a possible paradigm shift in fabrication technology?
  • Early Challenges & Limitations: What bottlenecks limited the successful implementation?
  • Early Successes: Setbacks, yes. But technical and commercial successes too!
  • Current Status: Progress being made, but challenges remain.
  • Opportunities and Future Directions: Changing electronics landscape suggests?

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